In the electronic product outsourcing/OEM/EMS model, customers are offered a full range of solutions and comprehensive electronic manufacturing services for SMT, DIP (insertion, touch-up, hand soldering), testing, assembly and packing.
Turnkey: HIPO’s material procurement service for procuring materials for printed circuit boards, electronic components (active and passive), body parts, and packing according to customers’ need. In addition, the full service model involves long-term collaboration with customers and integrates services from trial production, mass production, assembly and system integration to services such as distribution support and follow-up maintenance to enhance the competitive advantage of customers.